Loongson is making strides in semiconductor innovation with the development of its next-generation CPU family, known as the “3D7000″series, which boasts over 32 core chiplets.
Loongson’s Ambitious Plans for 32+ Core Chiplets in the Upcoming 3D7000 Server CPUs, Targeting a 2027 Launch
The Chinese semiconductor manufacturer Loongson is progressing with its next-generation server CPU line, the 3D7000 series, slated for release in 2027. This upcoming lineup promises to utilize cutting-edge sub-10nm process technology to enhance performance and efficiency.
In contrast, Loongson’s current offerings include the 3C60000 processors, which utilize a 1X nm process node likely around 12nm. These processors feature impressive 16-core chiplets and can scale to 64 cores in four-chiplet configurations, with a thermal design power (TDP) of up to 300W. The company also provides its 3D5000 workstation family, which offers models with up to 32 cores operating at 2.0 GHz.
Machine Translated via Loongson
With the forthcoming 3D7000 series, Loongson is set to take a significant leap by integrating chiplets featuring 32 or more cores, effectively doubling the core count of its predecessors. The company has commenced intellectual property (IP) design work associated with this advanced process technology and has plans to support next-generation features, including DDR5 memory and PCIe 5.0 connectivity.
The introduction of 32+ core CPU chiplets represents a major accomplishment for Loongson. In comparison, AMD’s upcoming Zen 6 architecture will offer two core configurations: a standard 12-core and a denser 32-core version, both aimed at the server market. While AMD’s launch is expected next year, Loongson is targeting 2027 for its new chips, with potential deployment as early as 2028. Details regarding the architecture, specific WeUs, and clock speeds for the 3D7000 series remain undisclosed.
Moreover, Loongson has announced the anticipated release of its 9A1000 discrete GPU, aimed at entry-level solutions for AI PCs, expected to arrive next year. The company is working to ensure driver compatibility with the Windows operating system and is nearing the tape-out phase of this product. The significance of these launches is underscored by the increasing demand within the Chinese market for domestically manufactured technology in place of foreign alternatives.
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