
Recent leaks have emerged about AMD’s upcoming 6th Generation EPYC Venice CPUs, which are designed with new Zen 6 and Zen 6C core architectures and could feature a remarkable 256 cores.
AMD’s EPYC Venice CPUs: Up to 256 Cores on Zen 6 & Zen 6C Architectures
The buzz surrounding AMD’s 6th Gen EPYC Venice CPU lineup has intensified since the company confirmed that these processors will utilize TSMC’s cutting-edge 2nm process technology. Insights into these high-performance chips began surfacing in 2022, with a steady stream of updates recorded throughout 2023, building anticipation among industry stakeholders.
According to assertions from previous reports, the Venice CPUs will be available in two versions, echoing the configurations of the Zen 5 and Zen 4 series. These will comprise a standard Zen 6 variant and a more compact Zen 6C variant, both compatible with SP7 and SP8 sockets. The SP7 socket will cater to higher-end applications, while the SP8 socket will support entry-level servers. Notably, this platform will offer 16 and 12 channels of memory support.

Diving into the technical aspects, several specifications have surfaced via leaks on the Tieba Baidu forums. These leaks indicate a chip design featuring eight chiplets (CCDs)—four on each side—each housing 12 Zen 6 cores. The design includes several I/O die (IOD), enhancing the I/O functionalities for these server processors.

This configuration totals an impressive 96 cores and 192 threads, matching the core count of AMD’s current EPYC 9005 series based on the Zen 5 architecture. However, these new processors are rumored to include up to 128 MB of L3 cache per chiplet. While it remains unclear whether this cache allocation pertains to the Zen 6 or Zen 6C variants, the Zen 6C EPYC chips would maintain a significant 2 MB of L3 cache per core. For the EPYC 9006 series featuring the Zen 6 architecture, the expected specs are 96 cores and 192 threads supported by eight chiplets, whereas the Zen 6C models will scale up to 256 cores and 512 threads.
SP8: up to 128 Zen 6C cores with 128 MB per CCD (96 cores for Zen 6 models), 350-400w
SP7: up to 256 Zen 6C cores, ~600w https://t.co/CQodEenhBk
— Bionic_Squash (@SquashBionic) May 10, 2025
Further insights from Bionic_Squash suggest that the SP7 variants are anticipated to operate at a thermal design power (TDP) around 600W, an increase from the 400W typical of the Zen 5 architecture. In contrast, the SP8 models are projected to maintain a TDP range of 350-400W. Below are the summarized specifications:
- EPYC 9006 “Venice”With Zen 6C: 256 Cores / 512 Threads / Up to 8 CCDs
- EPYC 9005 “Turin”With Zen 5C: 192 Cores / 384 Threads / Up to 12 CCDs
- EPYC 9006 “Venice”With Zen 5: 96 Cores / 192 Threads / Up to 8 CCDs
- EPYC 9005 “Turin”With Zen 5: 96 Cores / 192 Threads / Up to 16 CCDs
This extensive lineup promises a diverse selection of WeUs for data centers and high-performance computing (HPC) customers. While these specifications are preliminary, the Zen 6 processors are expected to launch next year, paving the way for more detailed announcements from AMD in the near future.
Overview of AMD EPYC CPU Families:
Family Name | AMD EPYC Venice | AMD EPYC Turin-X | AMD EPYC Turin-Dense | AMD EPYC Turin | AMD EPYC Siena | AMD EPYC Bergamo | AMD EPYC Genoa-X | AMD EPYC Genoa | AMD EPYC Milan-X | AMD EPYC Milan | AMD EPYC Rome | AMD EPYC Naples |
---|---|---|---|---|---|---|---|---|---|---|---|---|
Family Branding | EPYC 9006 | EPYC 9005 | EPYC 9005 | EPYC 9005 | EPYC 8004 | EPYC 9004 | EPYC 9004 | EPYC 9004 | EPYC 7004 | EPYC 7003 | EPYC 7002 | EPYC 7001 |
Family Launch | 2026? | 2025 | 2025 | 2024 | 2023 | 2023 | 2023 | 2022 | 2022 | 2021 | 2019 | 2017 |
CPU Architecture | It was 6 | It was 5 | Zen 5C | It was 5 | It was 4 | It was 4C. | Zen 4 V-Cache | It was 4 | It was 3 | It was 3 | It was 2 | It was 1 |
Process Node | 2nm TSMC | 4nm TSMC | 3nm TSMC | 4nm TSMC | 5nm TSMC | 4nm TSMC | 5nm TSMC | 5nm TSMC | 7nm TSMC | 7nm TSMC | 7nm TSMC | 14nm GloFo |
Platform Name | SP7 | SP5 | SP5 | SP5 | SP6 | SP5 | SP5 | SP5 | SP3 | SP3 | SP3 | SP3 |
Socket | TBD | LGA 6096 (SP5) | LGA 6096 (SP5) | LGA 6096 | LGA 4844 | LGA 6096 | LGA 6096 | LGA 6096 | LGA 4094 | LGA 4094 | LGA 4094 | LGA 4094 |
Max Core Count | 256 | 192 | 128 | 128 | 64 | 128 | 96 | 96 | 64 | 64 | 64 | 32 |
Max Thread Count | 512 | 384 | 256 | 256 | 128 | 256 | 192 | 192 | 128 | 128 | 128 | 64 |
Max L3 Cache | Up to 128 MB | 1536 MB | 384 MB | 384 MB | 256 MB | 256 MB | 1152 MB | 384 MB | 768 MB | 256 MB | 256 MB | 64 MB |
Chiplet Design | 8 CCDs (1 CCX per CCD) + 2 IOD? | 16 CCDs (1 CCX per CCD) + 1 IOD | 12 CCDs (1 CCX per CCD) + 1 IOD | 16 CCDs (1 CCX per CCD) + 1 IOD | 8 CCDs (1 CCX per CCD) + 1 IOD | 12 CCDs (1 CCX per CCD) + 1 IOD | 12 CCDs (1 CCX per CCD) + 1 IOD | 12 CCDs (1 CCX per CCD) + 1 IOD | 8 CCDs (1 CCX per CCD) + 1 IOD | 8 CCDs (1 CCX per CCD) + 1 IOD | 8 CCDs (2 CCXs per CCD) + 1 IOD | 4 CCDs (2 CCXs per CCD) |
Memory Support | DDR5-XXXX? | DDR5-6000? | DDR5-6400 | DDR5-6400 | DDR5-5200 | DDR5-5600 | DDR5-4800 | DDR5-4800 | DDR4-3200 | DDR4-3200 | DDR4-3200 | DDR4-2666 |
Memory Channels | 16-Channel (SP7) | 12 Channel (SP5) | 12 Channel | 12 Channel | 6-Channel | 12 Channel | 12 Channel | 12 Channel | 8 Channel | 8 Channel | 8 Channel | 8 Channel |
PCIe Gen Support | TBD | TBD | 128 PCIe Gen 5 | 128 PCIe Gen 5 | 96 Gen 5 | 128 Gen 5 | 128 Gen 5 | 128 Gen 5 | 128 Gen 4 | 128 Gen 4 | 128 Gen 4 | 64 Gen 3 |
TDP (Max) | ~600W | 500W (cTDP 600W) | 500W (cTDP 450-500W) | 400W (cDP 320-400W) | 70-225W | 320W (cTDP 400W) | 400W | 400W | 280W | 280W | 280W | 200W |
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