Launch of AMD Instinct MI350: Featuring 3nm Technology, 185 Billion Transistors, 288 GB HBM3E Memory, FP4 & FP6 Compatibility, and MI355X Outpacing MI300 by 35x and Blackwell B200 by 2.2x

AMD has made a significant advancement in high-performance computing and artificial intelligence with the introduction of its next-generation Instinct MI350 series GPUs. This series features two models, the MI350 and the flagship MI350X, boasting an impressive count of up to 185 billion transistors.

Introducing the AMD Instinct MI350 Series: Revolutionizing AI and HPC with Cutting-Edge Technology

The newly released AMD Instinct MI350 series marks a pivotal moment in GPU technology, integrating the highly efficient CDNA 3 architecture built on TSMC’s groundbreaking 3nm process node. These chips come in two variations: the MI350 and the more robust MI350X, both available in air-cooled and liquid-cooled designs. Each variant supports advanced AI data types, specifically FP4 and FP6, alongside expansive HBM3e memory capacities.

One of the standout features of the MI350 series is its impressive AI compute capability, delivering up to 20 PFLOPs with FP4/FP6 workloads. This represents a remarkable fourfold increase in performance compared to the previous generation. Furthermore, both models are equipped with HBM3e, ensuring exceptionally high data transfer speeds, complemented by a staggering memory capacity of 288 GB.

In addition, the MI350 series introduces UBB8, a novel standard for Rapid AI infrastructure deployment, which streamlines the installation processes for both air and liquid-cooled nodes, enhancing operational efficiency.

With these innovative features, the AMD Instinct MI350 series positions itself as a formidable contender in the realms of AI and high-performance computing. Its advanced architecture and cutting-edge technology are set to empower researchers, data scientists, and enterprises looking to leverage the full potential of AI.

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