Japan’s Rapidus Competes with TSMC in Cutting-Edge 2nm GAA Node Chip Technology

Japan’s Rapidus Competes with TSMC in Cutting-Edge 2nm GAA Node Chip Technology

The competition in the semiconductor industry is intensifying, particularly within the 2nm node segment. Japan’s Rapidus has unveiled a significant breakthrough that positions it among industry leaders like TSMC and Samsung.

Rapidus Makes Headway in 2nm Production with Innovative Technology

Historically, TSMC has dominated the chip manufacturing landscape, closely followed by Samsung and Intel. However, Rapidus is poised to enter the 2nm arena, showcasing formidable advancements. In a recent announcement, the company revealed that it has successfully prototyped a 2nm chip utilizing Gate-All-Around (GAA) technology at its IIM-1 foundry. This achievement positions Rapidus as a pioneer in the mass production of GAA technology at this node size, with expectations to commence large-scale production by 2027.

To optimize production efficiency, Rapidus has implemented a “single-wafer”processing strategy during the initial manufacturing phases. This approach allows for real-time adjustments and enhancements, enabling Rapidus to leverage the capabilities of artificial intelligence for production feedback. By refining processes and bolstering yield rates, Rapidus is among the first to adopt these cutting-edge methods in its 2nm production line, underscoring the importance of precision during the critical sampling stage.

Silicon wafer with colorful iridescent patterns on a dark background.

Another significant milestone for Rapidus is its utilization of extreme ultraviolet (EUV) lithography technology, making it the first company in Japan to adopt such advanced machinery. The integration of ASML’s equipment further aligns Rapidus with the technological capabilities of TSMC in lithography, highlighting its serious commitment to innovation. The company aims to release 2nm GAA process design kits (PDKs) by Q1 2026, paving the way for customized solutions ahead of a full-scale production launch in 2027, nearly a year after TSMC’s expected timeline.

As Rapidus continues to advance its technology, the industry’s dynamics could shift. The emergence of new competitors like Rapidus could introduce necessary diversity into the semiconductor market, especially as established players appear to face challenges in maintaining their lead.

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