ASML Reports Surge in Memory Chip Orders Surpassing Logic as DRAM Manufacturers Compete for EUV Slot Availability

ASML is advancing its commitments to AI-powered infrastructure amidst surging demand for both logic and memory chips in the semiconductor sector.

ASML Provides Insights on Ongoing Chip Demand and Strategic Investments

During the Q1 2026 earnings discussion, ASML’s President and CEO, Christophe Fouqet, emphasized the company’s strategic increase in investments aimed at accelerating the production of advanced logic and memory chips. This surge is critical to supporting the expanding AI ecosystem as the demand from AI factories reaches unprecedented levels.

As companies enhance their production capacities, the primary driver is to mitigate constraints affecting various end markets, such as AI, mobile devices, and personal computers.

In terms of financial performance, ASML’s Q1 2026 sales breakdown revealed that 51% of their revenue was generated from memory-related systems, with the remaining 49% attributed to logic designs. Notably, Extreme Ultraviolet (EUV) technology accounted for a dominant 66% of this revenue, while Deep Ultraviolet (DUV) machines captured 23%.

Net system sales breakdown (quarterly) chart showing Q1'26 net sales of €6.3 billion, with 66% from EUV technology and sales for Q4'25 at €7.6 billion, with South Korea leading in sales.

Regionally, South Korea emerged as a major player in the semiconductor landscape, accounting for 45% of net sales. This was followed by Taiwan at 23% and China at 19%, while the USA represented 12% of sales in Q1 2026. ASML primarily supplies EUV and DUV systems to industry giants like Samsung, TSMC, SMIC, and Intel. Although there are current restrictions on selling high-end EUV machines to China, DUV sales are still permitted. However, changes may be on the horizon as U. S.lawmakers consider extending export bans to include DUV technology.

Looking ahead, the outlook for the semiconductor industry’s growth remains robust, primarily fueled by investments in AI-related infrastructure. This continues to drive the demand for advanced logic and memory chips across various sectors. For the foreseeable future, the disparity between demand and supply will persist, creating challenges across different market segments.

— Christophe Fouqet, President, CEO of ASML

The demand for cutting-edge EUV and DUV machinery continues to escalate, particularly in the memory sector, as DRAM manufacturers transition to new process nodes. ASML is responding to this surge in orders by collaborating with partners to fulfill their demands and introducing “productivity upgrades”aimed at optimizing production efficiency in the short term.

These advancements are vital for the expected release of new accelerators from leading companies like NVIDIA and AMD, which are anticipated to see high demand.

Both advanced DRAM and logic customers are not only expanding their capacities but are also increasingly adopting EUV and Immersion DUV technologies for new process nodes. This shift amplifies the need for advanced lithography solutions. Consequently, our order intake remains exceptionally strong as we work closely with our clients to meet their evolving requirements, while also providing productivity enhancements for existing installations.

— Christophe Fouqet, President, CEO of ASML

ASML is making strides toward the introduction of a new Low NA EUV machine which aims to achieve a throughput of at least 330 Wafers Per Hour (WPH).This system is expected to be unveiled at the start of the next decade. Furthermore, the company has launched its NXE:3800E PEP-E machine, which enhances output from 220 WPH to 230 WPH with comparable overlay performance.

ASML NXE:3800E PEP¹-E machine features presentation slide highlighting increased throughput from 220 WpH to 230 WpH.

Technological advancements remain a priority, and we have recently showcased considerable progress at the SPIE Advanced Lithography and Patterning Conference in February. Our updated Low NA EUV roadmap illustrates improvements that will allow for at least 330 WPH by the start of the next decade, largely driven by enhancements in our source power capabilities, as evidenced by a recent demonstration of a 1, 000-watt source.

— Christophe Fouqet, President, CEO of ASML

According to ASML’s future strategy, the company aims to release the advanced NXE:4200G Low-NA systems capable of 300 WPH by 2029-2030. Concurrently, the rollout of the High-NA EVU system, specifically the EXE:5200D, will focus on producing sub-2 nm class chips (like A14 and beyond) with a throughput of at least 175 WPH.

ASML EUV product roadmap presentation slide showcasing advancements from 2023 to 2033 and product details.

ASML also plans to enhance its chip production by 50% in the next decade through a 66% increase in light source power in its machines. Although this improvement will not materialize until 2030, the company is proactively addressing supply chain constraints by upgrading both existing and upcoming machinery to achieve higher wafer output rates.

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