iPhone 17 Air May Retain A19 Pro Thermal Efficiency Using Innovative ‘Copper Post’ Technology Without Compromising Performance

The upcoming iPhone 17 Air is set to be Apple’s most slender smartphone yet, with a profile measuring a mere 5.5mm. While this design may be visually appealing to users who prioritize aesthetics, it raises significant concerns regarding performance and battery longevity. The device is expected to possess a notably small battery, which could impact overall usage time. Furthermore, this slim chassis risks thermal throttling issues, potentially limiting the performance of the rumored A19 Pro chip. However, recent reports suggest that Apple may mitigate these challenges by incorporating a new innovation known as ‘Copper Post.’

Innovative ‘Copper Post’ Technology: A Game Changer for iPhone 17 Air

With the highly anticipated ‘Awe Inspiring’ keynote approaching, a wealth of information remains unconfirmed regarding Apple’s future devices. Fortunately, a report from Joongang reveals that Apple is addressing the thermal throttling dilemma of the iPhone 17 Air through the introduction of ‘Copper Post’ technology. This advanced solution, developed by LG Innotek, will be employed in the flagship model for the first time.

The traditional methodology for connecting the logic board to the semiconductor substrate utilizes solder balls. However, the Copper Post technique innovatively replaces this with copper posts topped with semicircular solder balls. This modification not only decreases the component’s size but simultaneously enhances the production of semiconductor substrates by up to 20 percent. As a result, Apple can create thinner models, like the iPhone 17 Air, without sacrificing essential performance benchmarks.

iPhone 17 Air to reportedly use Copper Post technology to maintain the A19 Pro's thermals — This illustrates how Copper Post technology will function within a smartphone.

In addition, the potential application of Copper Post technology extends beyond the iPhone 17 Air; it may also play a crucial role in next year’s foldable iPhone. With dual sides requiring seamless folding and unfolding, the integration of this innovative technology could facilitate a slimmer profile while ensuring effective heat dissipation. The key question that remains is whether this new approach will outperform the current vapor chamber technology utilized in the iPhone 17 Pro and iPhone 17 Pro Max.

For more details, refer to the full report at Joongang.

Additional insights can be found at Wccftech.