Intel’s Ex-‘Inventor of The Year’ Expert in Glass Substrates Joins Samsung, Indicating Team Blue is Shifting from Core Team and Vision

Intel has recently faced a significant setback in talent retention, with the departure of Gang Duan, a key figure in the company’s development of glass substrates and EMIB technology, who has joined the ranks of rival Samsung.

Intel’s Diminished Prospects in the Glass Substrate Sector

In a series of strategic shifts, Intel has undertaken drastic organizational changes focused on curbing operating losses and bolstering shareholder value. This transformation has led to the cancellation of ambitious projects, extensive layoffs, and the exit of pivotal employees. Notably, Duan, a former principal engineer in Substrate Packaging Technology, stands as a prime example of this exodus.

Professional experience in executive roles at Samsung and Intel.

Duan has updated his LinkedIn profile to reflect his new position as Executive VP for Packaging Solutions at Samsung. This promotion signifies a notable advancement in his career, while simultaneously highlighting Intel’s diminishing interest in non-mainstream projects that could be pivotal for its future. With over 17 years of experience at Intel, Duan was recognized as the ‘Inventor of the Year’ in 2024. His contributions include:

In his 16 years at Intel, Duan has amassed nearly 500 patent applications in his quest to help push the envelope of how silicon dies are combined in packages — inventing better interconnects, embedding tiny connector chips within the substrate (as in Intel EMIB) and pioneering glass substrates.

Recent reports indicate that Intel has decided to halt its quest for glass substrates to focus on verifying the viability of its expenditures, referred to as “blank checks.”Despite a leading edge in the development of glass substrate technology, Intel’s internal sources suggest a concerning retreat from this innovative path. Initially, the company aimed to incorporate this technology into its packaging services by the end of 2025, outpacing competitors who are still navigating implementation challenges.

Gloved hand holding a semiconductor wafer with intricate circuit patterns.

Duan’s move to Samsung underscores the potential forfeiture of Intel’s extensive investment in this technology. While the company might see short-term savings, such decisions could have long-lasting ramifications, especially considering Intel’s current struggles to maintain competitiveness across various segments.

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