Intel’s 18A Process Set for Chip Tape-Out by H1 2025 After Long Wait; Potential Industry Disruption Ahead

Intel has made a significant announcement regarding its advanced 18A process, confirming that it is now “ready”for rollout. The company anticipates the first tape-outs to occur by the first half of 2025, a development likely to shake up the competitive landscape in the semiconductor industry.

Intel’s 18A Process: A Potential Game Changer for the Semiconductor Market

The semiconductor sector is buzzing with excitement over Intel’s latest advancements, particularly in its foundry operation. This enthusiasm is not solely driven by technical specifications; it encompasses broader narratives involving industry leaders and government officials discussing the company’s prospects. A key focal point for Intel has been the remarkable strides made towards executing the 18A process, which is poised for market introduction soon.

Reaching this milestone has not been straightforward for Intel. The company has faced numerous challenges, especially under the leadership of former CEO Pat Gelsinger, who championed the “IDM 2.0″strategy. The Intel Foundry Services (IFS) division encountered significant hurdles, particularly with earlier processes like Intel 4 (7nm), which hampered its overall performance. Nevertheless, the 18A initiative is expected to catalyze a resurgence for the IFS, and it seems the company is nearing this recovery.

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Previous discussions about Intel’s 18A have highlighted several revolutionary features of this process. Notably, the implementation of Backside Power Delivery (BSPDN) marks a significant innovation allowing power delivery to shift to the back of the wafer. Additionally, the adoption of RibbonFET GAA technology and enhanced chip densities positions the 18A process as a formidable competitor to offerings from industry leader TSMC. This advancement could firmly establish IFS within mainstream markets.

The initial applications of the 18A process are expected to debut with Intel’s upcoming Panther Lake mobile system-on-chips (SoCs) and Clearwater Forest Xeon server CPUs. Furthermore, there’s speculation that next-generation Celestial discrete GPUs may also utilize this cutting-edge process, emphasizing Intel’s commitment to in-house production.

Currently, the status of partnerships incorporating the 18A process into external products remains uncertain. However, companies like Broadcom are reportedly in contention to adopt this technology. With tape-outs set for H1 2025, we can anticipate that the 18A process will become operational by the latter half of 2025, assuming Team Blue successfully achieves target yield rates and efficient chip integration.

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