Intel’s 18A Process in “Risk Production”: Foundry Division Prepares for a Major Comeback

Intel has exciting news for tech enthusiasts: their next-generation 18A manufacturing process has officially entered the “risk production”phase. This significant milestone suggests that full-scale production is on the horizon, sparking anticipation across the industry.

Upcoming Integration of Intel’s 18A Process in Panther Lake SoCs and Beyond

While Intel Foundry has faced challenges and sluggish growth in recent years, the introduction of the 18A node brings new hope for its resurgence. During the recent Intel Vision 2025 conference, the company confirmed the entry of the 18A process into risk production, with expectations for mass production to commence before year’s end. This development is certainly a welcome update for the company and its stakeholders.

Intel 18A has entered risk production 👏.

This final stage is about stress-testing volume manufacturing before scaling up to high volume in the second half of 2025.#IntelVision pic.twitter.com/SWzoZvbVO5

— Intel News (@intelnews) April 1, 2025

For those unfamiliar with the term, “risk production”refers to a crucial phase that precedes mass production. During this stage, Intel conducts limited-scale production runs to evaluate the manufacturability and performance of the new process. This step is essential for identifying potential production flaws, ultimately guiding the company in fine-tuning yield rates and overall efficiency. Once these parameters are confirmed, Intel can confidently proceed to mass manufacturing.

With this latest announcement, it is apparent that Intel is optimistic about overcoming previous hurdles associated with the 18A process. The first products to utilize this cutting-edge technology will likely be the Panther Lake system-on-chips (SoCs), set to hit the retail market by 2026. This timeline will provide a clearer picture of how effective the 18A process truly is, making it an exciting development to watch.

Intel’s 18A technology has been a recurring topic of discussion in the tech community, and now is an opportune moment for a closer examination, given the surrounding excitement. One of the standout innovations of the 18A process is the implementation of Backside Power Delivery Network (BSPDN).This method enhances power delivery efficiency by relocating the power distribution to the back of the wafer. Notably, the high-density variants of the 18A technology are achieving a remarkable macro bit density of 38.1 Mb/mm². As a result, prospects for the 18A manufacturing process appear very promising.

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