Intel has launched its Panther Lake “Core Ultra Series 3″CPUs, specifically designed for compact modules aimed at Edge AI and Embedded platforms.
Unveiling Intel’s Panther Lake CPUs in Compact Modules for Edge AI and Embedded Systems
At the Intel Tech Tour 2025, the company showcased its innovative Panther Lake modules tailored for Edge AI and Embedded applications. Shortly after the announcement, the first systems utilizing these cutting-edge modules have begun to make their debut.
Congatec has officially unveiled its new COM-HPC and COM Express modules, featuring the Intel Core Ultra Series 3 “Panther Lake”processors. These modules come in a range of compact, passport-sized designs, supporting up to 16-core configurations of the Intel Panther Lake-H CPUs, including the high-performance X9 388H, with a Thermal Design Power (TDP) of just 25W. The specifications for memory and I/O capabilities are modular, varying by design.
The memory specifications are particularly noteworthy, with several configurations available. For instance, two of the Panther Lake modules are equipped with onboard LPDDR5X memory. The conga-MC1000 version supports up to 32 GB at a high speed of 8533 MT/s, while the larger “conga-HPC”module can accommodate up to 96 GB of LPDDR5X memory, also operating within the same speed range. Additionally, two LPCAMM2 options present up to 96 GB of LPDDR5X memory with speeds varying from 7466 to 8533 MT/s, along with a SO-DIMM option that allows for two slots accommodating up to 128 GB of DDR5 memory at speeds up to 7200 MT/s.
According to Congatec, the Intel Panther Lake “Core Ultra Series 3″modules are capable of delivering impressive performance metrics, including up to 12 Xe3 cores and an astounding 120 TOPS of AI computing power, alongside a dedicated 50 TOPS NPU. These modules can support the simultaneous operation of three to four independent 6K displays and maintain optimal functionality across a temperature range from -40°C to 85°C. Notably, each module promises over 10 years of long-term availability. While the base TDP is set at 25W, configurations can be adjusted to range between 15W and 65W based on application requirements.
Key Module Sizes Include:
- COM Express Type 10 (84 mm x 55 mm)
- COM-HPC mini (95 mm x 70 mm)
- COM Express compact (95 mm x 95 mm)
- COM-HPC Client Size A (95 mm x 120 mm)
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