Intel Nova Lake CPUs Could Feature 18A-PT Process and Foveros Direct 3D Packaging, Similar to X3D Technology

The demand for an AMD “X3D”style architecture within the PC consumer market is palpable, and Intel’s upcoming Nova Lake desktop CPU series may just fulfill that expectation.

Intel’s Progress Towards Competing with AMD’s Innovative “X3D”CPUs

Intel appears to be on the cusp of a significant transformation in the desktop CPU arena. Despite facing challenges in gaining traction with recent product launches, such as the Arrow Lake CPUs, the company is poised for potential resurgence. Core Ultra 200S models, despite their lackluster performance metrics, have nudged some Intel enthusiasts to explore AMD alternatives. However, the forthcoming Nova Lake series might herald a significant shift, particularly due to announcements made during the Intel Direct Connect 2025 event that signal a potential “X3D”implementation on the horizon.

Intel has not shied away from discussing possibilities for a “3D V-Cache”technology. Former CEO Pat Gelsinger had previously suggested ambitions to develop such processors, leveraging proprietary technologies like Foveros and EMIB. Initially, indications pointed toward integrating additional cache tiles for server offerings, but consumer applications remain a potential focus for Intel in the near future.