
Intel is set to move away from its previous socket design for the forthcoming desktop processors, as indicated in the latest NBD shipping manifest. Interestingly, while the socket type is changing, the physical dimensions remain consistent.
Intel’s Nova Lake: A New Socket with Familiar Dimensions
As part of its typical upgrade cycle, Intel frequently alters socket types after one or two generations. The Nova Lake CPUs, Intel’s upcoming desktop processor series, will not be compatible with the LGA 1851 socket. This transition might pose a minor inconvenience to users upgrading from older systems, such as those utilizing LGA 1851 or LGA 1700 sockets, as they will need to invest in new motherboards. However, for those constructing a new PC, this shift is unlikely to disrupt plans significantly.
On a positive note, enthusiasts can rest easy knowing that existing CPU coolers will remain compatible. The newly designed LGA 1954 socket shares identical dimensions with its predecessors—the LGA 1851 and LGA 1700—measuring at 45 x 37.5 mm. The recent NBD shipping information disclosed these socket dimensions, marking a first for such detailed log entries.

Although your current CPU cooler should fit the LGA 1954 socket, a motherboard upgrade will still be necessary. Expect motherboards utilizing the LGA 1954 socket to fall under Intel’s 900 series, with the new Nova Lake CPUs likely branded as Core Ultra 400S. Previous generations like the Arrow Lake CPUs have been designated Core Ultra 200S, while the broader Core Ultra 300 naming scheme seems reserved for upcoming Panther Lake mobile processors, suggesting that Intel is skipping this series for Nova Lake.
The Nova Lake architecture promises an innovative hybrid design and is set to push the boundaries of mainstream CPUs by surpassing the 50-core threshold. The flagship model of this family could feature up to 52 cores, comprising 16 Coyote Cove P-Cores, 32 Arctic Wolf E-Cores, and 4 LPE-Cores. This significant increase surpasses the core count of Intel’s current flagship, the Core Ultra 9 285K processors from the Arrow Lake generation. Additionally, Intel may leverage its 14A process technology alongside TSMC’s 2nm node for various chip components. There is also speculation about Nova Lake processors potentially incorporating X3D technology, utilizing Intel’s upcoming 18A-PT node for advanced 3D integrated circuit designs.
In the context of competitive dynamics, Intel is keenly aware of the advancements made by AMD, particularly with its X3D chips. To maintain market relevance, stacking more 3D Cache chiplets within the Nova Lake architecture appears to be essential. We anticipate the official unveiling of Nova Lake processors next year, while Panther Lake chips are expected to launch in late 2025.
News Source: @RubyRapids
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