Intel Explores Innovative and Affordable Heat Spreader Solutions for Large Advanced Packaging Chips

Intel researchers have pioneered a method to streamline the assembly of heat spreaders, leading to better designs and cost efficiency for large-scale advanced packaging chips.

Intel’s Innovative Heatspreader Technology Opens New Doors for Advanced Chip Packaging

An insightful publication by Intel Foundry, titled “A Novel Disaggregated Approach of Assembling Integrated Heat Spreader for Advanced Packages“, highlights their research into a disaggregated model for heat spreaders. This new technique enhances manufacturing efficiency and maximizes cooling effectiveness for high-performance chips.

Comparison of 'Multi Cavity IHS for PoINT Package' with 'Simplified Heat Spreader Design' — Image Source: Intel

This cutting-edge heat spreader solution is tailored to support Intel’s “Advanced Packaging”approaches, particularly for chips that utilize multiple layers and chiplets. Notably, the new assembly process can reduce warping of packages by up to 30% and cut thermal interface material voids by 25%.This advancement marks a pivotal point that enables the production of “Extra-Large”advanced packaging chips, which would be unfeasible with conventional methods.

Engineers at Intel Foundry have developed a novel disaggregated strategy, breaking down intricate heat spreaders into simpler, cost-effective parts.
The innovative assembly process promises up to a 30% reduction in package warping and a 25% decrease in thermal interface material voids, significantly improving the cooling of high-power chips.
Importantly, this technique facilitates the creation of extra-large chip packages, a previously challenging endeavor due to cost and complexity constraints.

The research focuses on deconstructing complex single-piece heat spreaders into simpler components that can be easily assembled through standard manufacturing practices. By employing optimized adhesives and utilizing a flat plate design coupled with enhanced stiffeners, this method enhances Thermal Interface Materials (TIM) performance.

Comparison between 'Traditional IHS' and new integrated heat spreader design — Image Source: Intel

Historically, high-performance processors like CPUs and GPUs have relied on a metal heat spreader to manage heat distribution from the chip die to a heat sink. However, as chip designs grow in complexity and size—sometimes exceeding 7, 000 mm²—the demands on heat spreaders evolve, necessitating intricate designs with stepped cavities and varied contact points.

This complexity comes with increased costs because traditional stamping methods fail to create the required intricate shapes for advanced packaging layouts. Alternatives like CNC machining, while precise, introduce additional costs and potential supply chain delays. Intel’s recent research addresses these challenges head-on:

Revolutionizing Assembly with a Disaggregated Approach

Conventional semiconductor packaging typically uses solid, monolithic heat spreaders that need precise shaping for complex chip configurations. The disaggregated method introduces multiple distinct components, joined during assembly.

This technique utilizes existing assembly lines where components are sequentially attached. The flat plates serve as primary heat spreaders while stiffeners provide necessary structural integrity and form specific cavity shapes for varying chip architectures. Each component can be crafted with conventional stamping processes, significantly lowering the need for costly, specialized equipment.

Chart comparing 'Normalized Coplanarity' in different scenarios — Image Source: Intel

This innovative approach results in a 7% enhancement in package coplanarity—a key metric for evaluating the flatness of the assembled units before chip installation. Overall, this pioneering research positions Intel to lead in the development of massive chip packages using advanced technologies, while the Foundry engineers are also looking at ways to adapt this model for specialized cooling solutions, including high-conductivity metal composite heat spreaders and integration with liquid cooling systems.

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