Intel 18A Process Surpasses Intel 3: Breakthrough Technologies Enhance Performance, Power Efficiency, and Density with PowerVia and BSPDN

Intel’s upcoming 18A process is generating significant excitement within the semiconductor industry, as Team Blue sets its sights on reclaiming its leadership position.

Revolutionary Advancements of Intel’s 18A Process: Setting New Standards in Performance

While Intel has faced challenges across various divisions, the future appears promising thanks to the Integrated Device Manufacturing (IDM) initiatives under CEO Pat Gelsinger. The company’s commitment to enhancing its foundry services through vertical supply chain integration is beginning to bear fruit. The highly anticipated 18A process is set to launch soon, with notable advancements already presented at the VLSI Symposium 2025.

Some Technical Highlights 2025 VLSI

Intel 18A RibbonFET(GAA) and PowerVia(BSPDN)- over 30% density scaling and a full node of performance improvement compared to Intel 3

IMEC Advanced Packaging- frontside hybrid bonding 250nm pitch and backside through-dielectric vias to… pic.twitter.com/y5UD4SALgr

— Posiposi (@harukaze5719) April 20, 2025

The specifics disclosed highlighted that Intel’s 18A process has achieved more than 30% density scaling compared to its Intel 3 process. This impressive feat can be attributed to advanced technologies like PowerVia and Backside Power Delivery Network (BSPDN).Performance-wise, the 18A process demonstrates a 25% speed increase and a 36% reduction in power consumption at 1.1 volts based on a standard ARM core sub-block. Enhanced area utilization is also a significant advantage, enabling more efficient designs with potentially higher density.

A compelling feature of the 18A process is its “voltage droop”mapping, showcasing stability during high-performance scenarios. The integration of PowerVia technology significantly enhances power delivery stability. Supporting documentation also includes a cell library comparison indicating that the backside power delivery approach allows for tighter cell packing and improved area efficiency due to the liberated routing space on the front side.

Intel Panther Lake | Image Credits: PCGH

Overall, Intel’s 18A process stands as the most sophisticated foundry node to date, and with increasing yield rates, the expectations are high for a successful launch. When evaluated against competitors like TSMC, the 18A process matches SRAM density with TSMC’s N2, indicating that Intel is effectively closing the gap in node capabilities.

As for practical applications, we anticipate that the 18A technology will first be implemented in Panther Lake SoCs and Xeon “Clearwater Forest”CPUs. If Intel maintains its momentum in yield rates and progresses toward mass production, we could witness these innovations making their debut as early as 2026.

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