Initial Firmware Testing Shows Samsung Galaxy S25 FE’s Larger Vapor Chamber May Be Underutilized

The Samsung Galaxy S25 FE and its predecessor, the Galaxy S24 FE, feature the same graphics processing unit, the Samsung Xclipse 940. However, initial testing suggests that the S25 FE exhibits more significant throttling issues compared to the S24 FE.

Comparative Architecture: Samsung Galaxy S25 FE vs. S24 FE

CPU Performance – Both the Galaxy S25 FE and S24 FE are equipped with an identical CPU architecture featuring:
- 4 Cortex-A520 cores operating at 1.95 GHz
- 3 Cortex-A720 cores at 2.60 GHz
- 2 Cortex-A720 cores at 2.90 GHz
- 1 Cortex-X4 core clocked at 3.21 GHz for the S25 FE while the S24 FE runs at 3.11 GHz
GPU Specification – Both devices are powered by the Samsung Xclipse 940 GPU, which has a clock speed of 1, 095 MHz.
Manufacturing Process – Each system-on-chip (SoC) is built using the 4nm lithography technology.

Thermal Performance Issues of the Samsung Galaxy S25 FE

Despite having similar SoC architectures, the Samsung Galaxy S25 FE encounters notable thermal challenges. This is particularly concerning given that it incorporates a larger vapor chamber compared to the S24 FE.

According to preliminary firmware testing conducted by Android Authority, the S25 FE tends to heat up rapidly and experiences aggressive throttling performance when compared to its predecessor.

This unexpected outcome is highlighted by the device’s ability to maintain a mere 59% to 66% of its peak GPU performance during stress tests, in stark contrast to the Galaxy S24 FE, which can sustain around 71% to 72% of its peak performance.

The underlying reasons for these discrepancies could potentially be:

The initial firmware may be unoptimized, potentially improving through future updates.
The vapor chamber might not be functioning effectively, impacting heat dissipation.

As developments unfold, we will provide our readers with timely updates and deeper insights into this evolving situation.

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