HWiNFO Updates: Support for Nova Lake-S and Upcoming AMD Platform, Possibly Indicating AMD 900-Series for Zen 6

The upcoming version of HWiNFO is set to introduce enhanced compatibility with next-generation Intel and AMD processors, as detailed in the latest release notes.

HWiNFO v8.31 Release Notes Reveal Support for Intel Nova Lake-S and Upcoming AMD Platforms

This marks a notable moment in tech advancements as the Intel Nova Lake-S desktop processor family makes its debut in software release notes. Previously, the Nova Lake-S had surfaced primarily in NBD shipping manifests, making HWiNFO’s inclusion particularly noteworthy with the announcement of its forthcoming version 8.31.

On-screen text lists upcoming changes with v8.31, Build 5810 pre-release download link.

The forthcoming version 8.31 will enhance HWiNFO’s capabilities by providing full support for the Nova Lake-S architecture. While the Nova Lake architecture had been cataloged within HWiNFO’s records previously, it was referenced broadly rather than specifying distinct mobile or desktop variants. Recent analyses indicate that Intel’s Nova Lake-S is currently in the Pre-QS stage and will be equipped with the LGA 1954 platform. Initial reports of a 28-core variant have evolved, with newer findings suggesting a possible 52-core model.

Nova Lake S is expected to feature a flagship SKU with up to 52 cores — Nova Lake-S expected to feature a flagship SKU with up to 52 cores

In terms of configuration, Nova Lake-S is predicted to integrate 16 Performance cores (P-cores), 32 Efficient cores (E-cores), and 4 Low-Power cores (LP-E cores), making it a leader in mainstream desktop processing technology. With the addition of Nova Lake-S to HWiNFO, users can anticipate more accurate reporting of these processor specifications. Furthermore, version 8.31 will also incorporate support for AMD’s upcoming platforms, likely referring to the 900-series motherboards designed to succeed the current AM5 800-series lineup.

Reports indicate that the forthcoming AMD Zen 6 processors will likely continue to use the AM5 socket, suggesting a new lineup of X970, B950, and B940 chipsets. Although the specific naming conventions remain unconfirmed, AMD is anticipated to maintain a 900-series naming strategy. These new platforms are expected to launch alongside the Zen 6 processors, slated for release in the latter half of 2026.

The AMD Zen 6 lineup is predicted to utilize TSMC’s advanced 2nm “N2P” node for chiplet designs and a 3nm “N3P” node for the input/output die (IOD).In summary, both Intel’s Nova Lake-S and AMD’s Zen 6 appear poised for release in the upcoming year, which promises to intensify the competitive landscape for desktop processors.

For further details, you can visit the official HWiNFO page.

Source & Images: Wccftech