Huawei Leverages SMIC’s 7nm Technology for Kirin 9020 Chip, Suggests Limitations in Advanced Chipset Production

Earlier this month, Huawei introduced its Mate 70 series, sparking excitement among technology enthusiasts. These newly launched premium smartphones are powered by the Kirin 9020 chipset, marking a significant advancement over its predecessor, the Kirin 9010, which is utilized in the Pura 70 lineup. However, intriguing insights into the manufacturing process reveal challenges rooted in geopolitical factors. While initial leaks indicated that Huawei’s latest silicon was produced on a 6nm process, further investigation indicates that the Semiconductor Manufacturing International Corporation (SMIC) is still limited to the 7nm technology.

Enhanced Performance with Larger Die Size

According to reports, the Kirin 9020 chipset features a die size that is 15% larger than that of the Kirin 9010. This increase in size allows Huawei to incorporate more cache memory, thereby improving performance while utilizing the same lithography. Such enhancements are crucial for maintaining competitive performance metrics without migrating to a more advanced manufacturing process.

Impact of U.S. Trade Sanctions on Technological Advancement

A comprehensive analysis by TechInsights underscores the significant obstacles Huawei faces due to U.S. trade sanctions. These restrictions have effectively barred the company from accessing advanced manufacturing technologies from major players like TSMC and Samsung. As a result, Huawei has been compelled to rely on SMIC, which has not yet progressed beyond the 7nm process. Despite collaborative efforts by SMIC to develop a 5nm node, the low yield rates have rendered commercial production unfeasible, leaving the Kirin 9020 susceptible to high costs.

Similarities and Differences in Chip Packaging

Examining the Mate 70 Pro+, the latest reports indicated that its packaging markings bear resemblance to last year’s Kirin 9000S and the Kirin 9010, distinguished mainly by the identifiers ‘Hi36C0′ and ‘GFCV110.’ However, the notable difference is the increase in die size, which grants the Kirin 9020 the ability to maintain superior performance via enhanced cache allocation.

“The Kirin 9020 is hence an enhanced Kirin 9010 processor also manufactured using the same SMIC 7nm N+2 process (same minimum features, same BEOL and same critical dimensions) used to manufacture Kirin 9000S (HiSilicon Kirin 9000S ACE-2309-801 TechInsights Platform), which caused quite a stir in the semiconductor industry, due to the rapid progress SMIC has been able to make despite US sanctions, to be able to manufacture 7 nm devices with full SOC implementation.”

Future Challenges Ahead for Huawei

Despite receiving substantial financial backing from the government, SMIC is projected to remain at the 7nm manufacturing threshold until at least 2026. This stagnation puts Huawei at a distinct disadvantage compared to industry rivals who are set to mass-produce 2nm SoCs in the near future. With the semiconductor landscape evolving rapidly, Huawei is indeed at a critical juncture and must strategize effectively to remain competitive.

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