GMP Tests Reveal Ryzen 9 9950X “Zen5” CPU Performance Under Stress Workloads, Exact Reasons for Issues Remain Unclear

Recent testing has revealed troubling issues with the Ryzen 9 9950X CPU, as it experienced failures during runs under normal conditions. In both testing scenarios performed by the GMP Project, the CPU displayed significant signs of overheating, resulting in a discolored patch on its pin side, even when protective measures were in place.

GMP Project Investigates Ryzen 9 9950X CPU Failures in Two Separate Tests

It’s becoming increasingly apparent that motherboard compatibility issues may not be the sole cause of CPU malfunctions. While problems with ASRock boards paired with Ryzen 9000 series processors have been highlighted, reports of the Ryzen CPUs failing on ASUS motherboards are notably scarce. Recently, however, two separate instances involving the flagship Ryzen 9 9950X have emerged, both leading to a complete CPU shutdown.

According to findings from the GMP Project, both tests led to the CPU’s premature failure despite adhering to proper environmental and operational standards. The first occurrence took place earlier this year in February, followed by a second instance just days ago. Both tests yielded consistent results, with the notable pin side burnout occurring on CPUs utilized in setups featuring ASUS B650 chipset motherboards. The first test employed the ASUS Prime B650M-K with BIOS version 3057, while the second utilized the ASUS Prime B650M-A WiFi running BIOS version 3278.

Unbranded processor chip on a white surface. — Fried Ryzen 9 9950X, Image Credit: gmplib.org

While both motherboards are positioned as budget-friendly options, they are generally equipped to support high-end processors as long as extreme overclocking is not involved. Only minimal changes were made between the two setups, such as variations in power supply units (PSUs) and RAM configurations, while the cooling solution remained constant. The Noctua NH-U9S cooler, deemed a competent single-tower model, may not be ideally suited for the Ryzen 9 9950X, which has a thermal design power (TDP) rating of 170W under full load. Nonetheless, adequate cooling measures should have been effective.

Ambient temperatures during the tests were also controlled, with the initial test site recording temperatures below 20°C, while the second site reached just above 20°C. With additional fans and proper airflow strategies in place, the systems should not have overheated, especially since neither CPU was subjected to overclocking or overvolting. The surprising fact is that these failures occurred, especially when compared to the reliable performance of the Ryzen 9 7950X, which operated without such issues—despite generally running hotter and under prolonged stress.

Unbranded computer cooling block with thermal paste applied, resting on a table. — Image Credit: gmplib.org

One hypothesis raised by GMP suggests that the Ryzen 9 9950X was drawing excessive power compared to expectations during these tests. A potential contributing factor could be related to the mounting of the cooler in the second test, where it was positioned asymmetrically to aid in cooling the CPU’s hotter side. This setup may have resulted in inadequate thermal paste application, creating voids that prevented proper heat transfer between the CPU and the heatsink. However, it’s noteworthy that even the first test, with a centered heatsink installation, exhibited similar adverse results.

For readers interested in further information, the original findings can be referenced through GMP’s official publication: GMP Lib.

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