Minisforum has officially introduced its latest line of MoDT motherboards, showcasing the impressive Strix Halo series featuring the “AMD Ryzen AI MAX+”CPUs designed specifically for a Mini-ITX form factor.
Unveiling the AMD Ryzen AI MAX+ “Strix Halo”with Minisforum’s BD395i MAX MoDT Motherboard
Among the highly anticipated CPUs for desktop systems, AMD’s Strix Halo has garnered significant attention. The dream of a robust APU that combines a powerful integrated GPU with an efficient CPU is now a reality, made possible by the new Minisforum BD395i MAX motherboard. This compact Mini-ITX board is equipped with AMD’s flagship Ryzen AI MAX+ 395 SoC, offering a plethora of advanced features.
The BD395i MAX is designed based on the MoDT architecture, which integrates a mobile CPU into a desktop-ready motherboard, ensuring versatility and performance. This compact motherboard accommodates the SoC and incorporates LPDDR5X memory, all cooled under an expansive vapor chamber heat spreader, compatible with traditional AM4/AM5 cooling solutions.
The BD395i MAX is equipped with a premium voltage regulator module (VRM) to effectively support the AMD Ryzen AI MAX+ processors, featuring a single 8-pin power delivery connector. In addition, the motherboard includes a PCIe x16 slot and an M.2 SSD slot, with adequate cooling provided by a well-sized heatsink. The pre-installed IO plate comes with a heatsink cover, along with an ample selection of USB ports.
With the BD395i MAX, users can tap into the potential of up to 16 “Zen 5″CPU cores and a graphics performance boost from the 40 Compute Units of the “Radeon 8060S”GPU. The external memory capabilities offer support for 256-bit LPDDR5X, with configurations available up to 128 GB. While the pricing has yet to be announced, it’s anticipated that more details will emerge in the coming months.
In addition to the BD395i MAX, Minisforum also showcased the BD995M X3D MoDT motherboard, designed in mATX format. This model supports the high-performance Ryzen 9 9955HX and Ryzen 9 9955HX3D processors, featuring up to 16 CPU cores and up to 128 MB of L3 cache thanks to the innovative 3D V-Cache architecture.
To facilitate cooling, the BD995M X3D integrates a vapor-chamber heat spreader over the mobile FL1 chip. This motherboard stands out with its dual DDR5 DIMM layout, X870M chipset, triple M.2 slots, and two PCIe x16 slots. It provides a solid array of I/O options and utilizes dual 8-pin connectors for power delivery, hinting at impressive performance capabilities and overclocking potential. Though pricing remains unannounced, these motherboards are expected to debut by mid-2026.
For further updates, visit the original news coverage on Tweakers.
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