Industry Insiders Say Apple iPhone Chips Won’t Utilize Intel’s Advanced Node Technology

In recent discussions, Intel has generated significant buzz regarding a potential re-engagement with Apple, particularly concerning the supply of M-series processors and standard iPhone chips. However, insights from industry experts suggest that this possibility may be limited due to technical constraints associated with Intel’s advanced chip manufacturing processes.

Thermal Challenges of Intel’s Advanced Chip Nodes for Apple Devices

Recent reports from financial analysts at GF Securities and publications like DigiTimes indicate that Apple may consider Intel’s 18A-P manufacturing process for its entry-level M-series processors set to debut in 2027, along with non-Pro iPhone models in 2028. Furthermore, GF Securities has pointed out that Apple’s custom ASIC, anticipated for release in 2028, will utilize Intel’s innovative EMIB packaging technology.

Additionally, it has come to light that Apple has initiated a non-disclosure agreement (NDA) with Intel and has received process design kit (PDK) samples from Intel’s 18A-P technology for evaluation. Notably, Intel’s 18A-P is the pioneering node to incorporate Foveros Direct 3D hybrid bonding, a technique facilitating the stacking of multiple chiplets via through-silicon vias (TSVs).

Jukan’s Commentary: The reason TSMC emphasized that A16 is HPC-exclusive is that implementing BPD requires a specific process step that must be performed during the wafer flip, and that step significantly degrades the heat dissipation (thermal spreading) performance of backside… https://t.co/H9Xg0u7m0v

— Jukan (@jukan05) February 1, 2026

Despite these developments, several industry insiders, as discussed in the SemiWiki forum, express skepticism about Intel’s potential role in manufacturing Apple’s iPhone chips. The prevailing concern stems from Intel’s strategic decision to fully adopt Backside Power Delivery (BSPD) technology for its cutting-edge 18A and 14A nodes, a choice that may hinder thermal efficiency.

A table titled 'Industry Adoption' lists BSPD brands like Intel's 'PowerVia' expected in 2025 and TSMC's 'Super Power Rail' — BSPD Industry Adoption; Source

Unlike TSMC, which offers a selection of nodes with and without BSPD technology, Intel has fully committed to BSPD for its new 18A and 14A nodes. While this approach does provide performance benefits by facilitating shorter metal paths for power delivery, it introduces significant thermal challenges, particularly for mobile applications.

The advantages of BSPD are somewhat limited in mobile chip contexts. While it can enhance performance by lowering voltage drop and allowing for higher operating frequencies, it also exacerbates the Self-Heating Effect (SHE). This effect necessitates additional cooling solutions, as the chips must maintain a lower temperature under demanding conditions. For instance, a heatsink needs to operate approximately 20°C cooler to manage hotspots effectively—an impractical requirement for many systems relying on air cooling methods or having strict temperature limitations (as highlighted by IanD’s comments in this thread).

Given these thermal challenges, industry commentators assert that the chances of Intel securing a contract to manufacture Apple’s iPhone chips are exceedingly slim, as articulated by Jukan in his commentary on social media. Nevertheless, the potential for Apple’s M-series processors to engage with Intel remains a viable, yet cautious, outlook.

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