Big Tech’s Interest Grows in Glass Substrates for Next-Gen Chips, Apple and Tesla Set to Adopt

Recent developments indicate that major technology companies, including Apple and Tesla, are beginning to embrace glass substrates. This shift has sparked interest within the semiconductor industry, with a report suggesting ongoing discussions between these companies and manufacturers regarding the incorporation of this innovative technology into their upcoming products.

The Benefits and Challenges of Glass Substrates in Technology

Glass substrates have been a topic of conversation in semiconductor circles for several years, emerging as a potential alternative to conventional organic substrates used in chiplet packaging. According to a report by ETNews, Apple’s and Tesla’s exploration of this technology highlights their recognition of its potential impact on future products. If the technology matures sufficiently, it could be utilized in Tesla’s next-generation Full Self-Driving (FSD) chips and in Apple’s proprietary silicon.

Both tech giants appear to be committed to understanding and implementing glass substrates. Notably, Apple has been proactive, visiting equipment suppliers to delve deeper into the technology. The report mentions potential applications, such as integrating glass substrates in Tesla’s FSD chips and employing them in Apple’s application-specific integrated circuits (ASICs), which could extend to devices like the iPhone and MacBook.

Next-Gen Intel Chips Will Feature More Sand As Glass Is Set To Replace Organic Substrate Materials 1 — Glass substrate test units are pictured at Intel’s Assembly and Test Technology Development facilities in Chandler, Arizona, July 2023.(Credit: Intel Corporation)

For those unfamiliar, glass substrates replace the organic core in sophisticated chip packages, enabling the integration of multiple redistribution layers (RDL).This framework facilitates the routing of signals and power among various chips, effectively enhancing performance. The denser nature of glass compared to organic materials allows manufacturers to increase the number of signals per layer, ultimately resulting in larger, and more intricate multi-die packages. This advancement is particularly advantageous for companies like Apple and Tesla, as it expands the possibilities for developing innovative products.

Despite their potential, the current maturity level of glass substrates presents some challenges for widespread industry adoption. Achieving consistency in supply chain processes is critical, especially concerning the handling of glass panels and the complexities involved in through-glass vias (TGV) drilling. Nevertheless, the growing interest from major industry players suggests that glass substrates are on track to become a key component in advanced semiconductor manufacturing. Interestingly, Intel had previously been a frontrunner in glass substrate technology, but the momentum appears to have diminished as of 2023, leading to uncertainty regarding future developments.

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