Benchmarked: AMD Ryzen AI MAX+ PRO 395 “Strix Halo” APU Featuring 16 Cores & Radeon 8060S “RDNA 3.5” Integrated GPU

Benchmarked: AMD Ryzen AI MAX+ PRO 395 “Strix Halo” APU Featuring 16 Cores & Radeon 8060S “RDNA 3.5” Integrated GPU

The latest AMD powerhouse, the Strix Halo APU known as the Ryzen AI MAX+ PRO 395, has made its debut on Geekbench. This cutting-edge APU boasts an impressive 16 cores and is equipped with a Radeon 8060S integrated GPU (iGPU).

AMD Strix Halo: Ryzen AI MAX+ PRO 395 with Advanced Features Unveiled

While AMD’s Strix Halo series, branded as “Ryzen AI Max”APUs, has been anticipated, this marks the first appearance of a model in the Geekbench database, hinting at an impending launch on the horizon. The Strix Halo series is slated for a formal introduction at CES 2025.

Diving into the specifics, the AMD Ryzen AI MAX+ PRO 395 features a robust configuration, including 16 Zen 5 cores aligned with AMD’s recent announcements and leaks. The APU was assessed using the AMD MAPLE-STXH reference board for preliminary evaluations.

Image Source: Geekbench

Examining its technical specifications, the Ryzen AI MAX+ PRO 395 is built with 16 Zen 5 cores that support 32 threads. It operates with a base clock of 3.0 GHz, and anticipations are set for peak clock speeds reaching up to 4.4 GHz. Given that this is an early prototype, final boost clock speeds are expected to exceed current figures. In terms of cache, it features a dual chiplet design, offering 64 MB of L3 and 16 MB of L2 cache. Reports indicate that the thermal design power (TDP) will likely range from 55W to 130W, depending on workload.

Focusing on the integrated graphics capabilities, the AMD Strix Halo APUs will leverage the RDNA 3.5 architecture akin to the current Strix “Ryzen AI 300” series. However, the Halo models will deliver a more substantial iGPU architecture with up to 40 compute units, particularly in the Ryzen AI MAX+ PRO 395, which features the Radeon 8060S iGPU and supports 64 GB of DDR5 memory. Additionally, AMD has confirmed the use of the Radeon 8000 branding for the forthcoming RDNA 4 series, which is to be unveiled at CES.

Performance benchmarks have already been recorded, with the Ryzen AI MAX+ PRO 395 scoring an impressive 67,004 points on the Vulkan API test. This positions it ahead of the GeForce RTX 3050, although optimization and final performance metrics are still to be fully realized, given that testing was conducted on an early sample and unoptimized drivers.

Expected Features of the AMD Ryzen AI HX Strix Halo

  • Zen 5 Chiplet Architecture
  • Up to 16 CPU Cores
  • 64 MB Shared L3 Cache
  • 40 RDNA 3+ Compute Units
  • 32 MB MALL Cache for iGPU
  • 256-bit LPDDR5X-8000 Memory Controller
  • Integrated XDNA 2 Engine
  • Up to 60 AI TOPS
  • 16 PCIe Gen4 Lanes
  • Expected Launch in H2 2024
  • FP11 Platform with 55W to 130W TDP

Set to launch in 2025, AMD’s Strix Halo APUs will accompany a range of other Zen 5 mobile products, including Fire Range and Krackan Point. These innovations are anticipated to permeate various devices like laptops, tablets, handhelds, and Mini PCs, enhancing computing capabilities across the board.

AMD Ryzen AI MAX 300 “Strix Halo”APU Lineup Overview

SKU Name Architectures CPU Cores GPU Cores TDP
Ryzen AI Max+ 395 Zen 5 / RDNA 3.5 16 / 32 40 CUs (Radeon 8060S) 55-130W
Ryzen AI Max 390 Zen 5 / RDNA 3.5 12 / 24 40 CUs (Radeon 8060S) 55-130W
Ryzen AI Max 385 Zen 5 / RDNA 3.5 8 / 16 32 CUs (Radeon 8050S) 55-130W
Ryzen AI Max 380 Zen 5 / RDNA 3.5 6 / 12 16 CUs (Radeon 8XXXS) 55-130W

Source of Updates: Benchleaks

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