AORUS X870i AORUS PRO Revision 1.1 Introduces Updated Memory Configuration for Zen 6 Compatibility

In the wake of the MSI announcement, GIGABYTE appears to be gearing up its 800-series motherboards for the upcoming Zen 6 processors. Notably, these new chips will not accommodate the standard memory configuration currently in use.

GIGABYTE AORUS X870i AORUS PRO ICE: New DDR5 Memory Configuration “AB”

Just yesterday, MSI unveiled a revision to its B850 series motherboard, showcasing a fresh memory configuration as opposed to the one initially made available to consumers. The standard A1B1 (DIMM A1, DIMM B1) setup has transitioned to an A2B2 (DIMM A2, DIMM B2) layout—an uncommon sight on dual-slot motherboards. Today, attention turns to the GIGABYTE X870i AORUS PRO ICE, a compact ITX motherboard that originally launched with the A1B1 configuration. However, the YouTube channel Tin Học Ngôi Sao recently acquired a version featuring the “AB”configuration.

Close-up of X870I AORUS PRO motherboard, featuring AM5 socket and DDR5 compatibility. — Overview of the new memory configuration on GIGABYTE X870i AORUS PRO ICE Version 1.1

The significance of the naming—whether GIGABYTE opts for A2B2 or AB—lies in the functionality. The new configuration diverges from the original A1B1 design, meaning that the BIOS for the earlier version is incompatible with the updated one. Reports indicate that this update marks Rev 1.1 of the X870i, tailored for memory compatibility with the imminent Zen 6 processors. This alteration relates to the innovative architecture of Zen 6, which is set to feature dual Integrated Memory Controllers (IMCs), enhancing performance and stability.

Comparison of AORUS X870I motherboards, highlighting design and DDR5 features — Comparative Analysis: Version 1.0 Versus Version 1.1 of the X870i AORUS PRO ICE

Given the implementation of dual IMCs, the memory layout must adapt accordingly, as Zen 6 processors will exclusively function with the A2B2 configuration—a trait found on four DIMM-slot motherboards. Although AMD may eventually extend support to the A1B1 configuration, the immediate compatibility landscape will only accommodate the A2B2 setup. This modification is designed to improve RAM frequency performance, allowing each memory controller to operate with a 1DPC (1 DIMM Per Channel) configuration. This shift promotes enhanced signal integrity and overall system stability.

Currently, AMD and its motherboard partners have yet to officially comment on these changes, yet the developments are unfolding in anticipation of the Zen 6 release, likely set for next year. Notably, the Zen 6 architecture seems poised to be the first in the AMD Ryzen series to integrate dual CCDs paired with dual I/O dies. This marks a significant evolution compared to previous models and is expected to yield substantial advancements in memory performance. Furthermore, Zen 6 is anticipated to enable up to 12 cores on a single CCD, effectively breaking through the long-standing 8-core limitation.

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