AMD’s Zen 6 Products to Leverage TSMC’s N2P Process, Lower-End Laptop SKUs Expected to Use N3P Technology

AMD is gearing up to make a significant impact in the CPU market with the upcoming release of its Zen 6 products, leveraging TSMC’s advanced N2P process. This notable combination of architectural enhancements and cutting-edge node technology positions Team Red to elevate performance significantly.

AMD’s Strategic Shift to TSMC’s N2P Node for Next-Gen CPUs

As the timeline approaches for the unveiling of next-gen solutions within the PC market, discussions and rumors about these developments are intensifying. Renowned leaker Kepler_L2 recently revealed that AMD intends to fully embrace TSMC’s N2P process for the majority of its server and consumer CPU offerings, with the exception of low-power mobile WeUs that focus on energy efficiency rather than peak performance.

The EPVC Venice lineup, which includes both Classic and Dense WeUs, will harness the power of TSMC’s N2P process. AMD’s status as the initial customer of TSMC’s 2nm node was established months ago, confirming its commitment to leading-edge technology. Moreover, the forthcoming Olympic Ridge architecture, poised to succeed the Ryzen 9000 series, will also utilize the N2P process, promising exceptional performance improvements. Additionally, the high-end laptop series, Gator Range, is expected to adopt N2P, indicating that TSMC’s 2nm technology will permeate AMD’s product offerings.

However, there is an exception with the Medusa Point 1 series. Here, higher-end WeUs will utilize a mix of N2P and N3P across different chiplets, where the more power-efficient models will rely solely on N3P to manage power consumption effectively. This strategic choice reaffirms AMD’s commitment to utilizing TSMC’s most advanced manufacturing processes for its CPUs.

Looking towards the competition, Intel plans to utilize its 18A node technology for both mobile and desktop platforms. This competitive landscape is expected to intensify, especially as Intel explores partnerships with TSMC for elements of its Nova Lake architecture. The next generation of CPUs is shaping up to be dynamic and competitive, a refreshing change from the previous one-sided contests.

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