AMD’s latest Strix Halo “Ryzen AI MAX”APUs have set a new benchmark as the fastest System on Chip (SoC) available, now offering DIY PC builders the ability to utilize them with innovative MoDT motherboards.
New Offerings for DIY PC Builders: Sixunited Introduces AMD’s Strix Halo “Ryzen AI MAX”
The Chinese technology firm, Sixunited, has recently launched its STHT1 Thin Mini-ITX motherboard, designed to fully leverage the capabilities of AMD’s advanced Strix Halo “Ryzen AI MAX”platform. This new series marries the impressive performance of fast Zen 5 CPU cores with a robust RDNA 3.5 GPU, encapsulating extraordinary computational power within a single chip.
Historically, the Strix Halo series has been limited to devices like laptops and mini PCs. However, the recent trend indicates manufacturers are exploring additional applications for this powerful chip, including handheld devices and DIY PC motherboards.
The STHT1 motherboard supports FP11-based AMD Strix Halo “Ryzen AI MAX”APUs. While there isn’t a specific WeU available from the manufacturer, the FP11 design allows it to potentially support any Ryzen AI MAX chip. Notably, this platform is non-socketed, meaning the chip is soldered directly onto the motherboard for enhanced stability and performance.
AMD Ryzen AI MAX 300 “Strix Halo”APU Specifications:
| SKU Name | Architecture | CPU Cores | Max Clock Speed | Cache Size | GPU Cores | TDP |
|---|---|---|---|---|---|---|
| Ryzen AI Max+ 395 | Zen 5 / RDNA 3.5 | 16 / 32 | 5.1 GHz | 80 MB | 40 CUs (Radeon 8060S) | 45-120W |
| Ryzen AI Max 390 | Zen 5 / RDNA 3.5 | 12 / 24 | 5.0 GHz | 76 MB | 40 CUs (Radeon 8060S) | 45-120W |
| Ryzen AI Max 385 | Zen 5 / RDNA 3.5 | 8 / 16 | 5.0 GHz | 40 MB | 32 CUs (Radeon 8050S) | 45-120W |
| Ryzen AI Max 380 | Zen 5 / RDNA 3.5 | 6 / 12 | 4.9 GHz | 22 MB | 16 CUs (Radeon 8040S) | 45-120W |
This motherboard can accommodate up to 128 GB of LPDDR5X-8000 memory, which is soldered directly onto the board. The high bandwidth from LPDDR5X is vital, as it supports the GPU’s performance capabilities. Additionally, the shared memory of 128 GB enables users to run expansive language models, making the STHT1 an excellent choice for a DIY AI workstation platform.
Examining the PCB design, Sixunited has committed to an impressive power delivery system with at least 16 VRM phases dedicated to the SoC, and a separate 4+1 phase configuration for other components.
The STHT1 motherboard also includes multiple connectivity options, featuring two M.2 2280 slots for Gen 4.0 x4 SSDs, a M.2 2230 slot for an add-on Wi-Fi card, and a variety of USB ports including 2 USB 3.2 Gen2 ports, 2 USB 3.2 Gen1 ports, and 7 USB 2.0 ports. Alternately, there is a different configuration available with three USB 3.2 Gen1 ports, 7 USB 2.0 ports, and 1 Type-C port. Display outputs include HDMI, DisplayPort, VGA, and COM, plus eDP for multi-monitor setups. Additionally, it features an RJ45 LAN port and a combined headset/microphone jack.
The design includes two fan headers, a 4-pin ATX power connector, and a 19V DC input at the rear. The compact motherboard measures 170x170mm, notably without PCIe slots, which may limit the use of additional AICs. However, the integrated solutions with the powerful RDNA 3.5 GPU negate the need for a discrete GPU in most scenarios.
The flagship Radeon 8060S with its 40 compute units offers performance on par with NVIDIA’s RTX 5060 Ti, yet does not need separate power delivery. Each chip is rated for up to 120W, and the board is equipped to handle this high power. Although pricing and exact availability in markets remain undisclosed, expected initial launches will target APAC regions. Competitive pricing is anticipated given the demand for Mobile on Desktop (MoDT) solutions, especially when compared to offerings from other vendors like Framework, which starts at $800 US.
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