AMD Ryzen “Zen 6” CPUs Launching with TSMC 2nm “N2P” CCD and 3nm “N3P” IOD Technology

AMD is set to revolutionize its Ryzen CPUs with the upcoming Zen 6 architecture, which will utilize TSMC’s advanced 2nm and 3nm manufacturing processes for its chip designs. This integration is expected to significantly enhance both performance and efficiency across Ryzen and EPYC CPU platforms.

AMD’s Zen 6 Ryzen CPUs: Enhanced Performance with TSMC’s N2P and N3P Technology, 2nm Ramp Anticipated by Q3 2026

The Zen 6 architecture is anticipated to redefine the landscape of desktop, mobile, and server solutions. AMD has confirmed that its Venice chiplets, featuring Zen 6 cores, will be produced using TSMC’s 2nm process technology. Recent reports from Kepler_L2 outline the process differentiation for various components of the Ryzen chips.

Specifically, the Ryzen CPUs based on Zen 6 will leverage TSMC’s N2P technology for the Core Complex Die (CCD) and implement the N3P process for the I/O Die (IOD).This strategic choice in manufacturing processes is expected to lead to substantial enhancements in computing capabilities.

Forum discussion with comments about chiplet-based CCD/CCX cores and process nodes. — Image Source: Anandtech Forums

Currently, the Zen 5 Ryzen CPUs utilize 4nm technology for CCDs and 6nm for the IOD. Within the upcoming Zen 6 architecture, the IOD will encompass essential components including memory controllers and various I/O interfaces (such as USB and PCIe), as well as integrated graphics processing units (iGPU).The CCDs will house Zen 6 cores, with each unit potentially featuring up to 12 cores, 24 threads, and a shared L3 cache of up to 48 MB—an increase from the 32 MB available in Zen 5’s 8-core configurations.

Key Features Expected from AMD’s Ryzen ‘Zen 6’ Desktop CPUs:

Potential for Double-Digit IPC Improvement
Increased Core Count and Thread Availability (Possibly Up to 24/48)
Enhanced Clock Speeds Due to Improved Process Node
Larger Cache Size (Possibly Up to 48 MB per CCD)
Support for Up to 2 CCDs and 1 IOD
Improved DDR5 Memory Speed Compatibility
Adoption of Dual IMC Design While Retaining Dual-Channel Setup
Comparable Thermal Design Power (TDP) Levels

Insights from Anandtech’s forum member, Adroc_thurston, suggest that TSMC’s N2P process will achieve volume ramp-up by Q3 2026. This implies that we might see the next-generation Ryzen CPUs featuring Zen 6 technology released as early as late Q3 2026, albeit in limited quantities.

Online forum post by adroc_thurston with replies mentioning N2P, q3'26, and Venice is launching in 2026, not 2027. — Image Source: Anandtech Forums

This timeline positions AMD strategically against Intel’s upcoming Nova Lake CPUs, which are targeting a similar release period. The competition is heating up, with AMD potentially offering up to 24 Zen 6 cores with 48 threads versus Intel’s Nova Lake-S lineup, which could feature up to 52 cores and 52 threads from the Compute Tile.

One notable advantage for AMD is the compatibility of its Ryzen “Zen 6″CPUs with existing AM5 platforms, unlike Intel’s Nova Lake-S, which will necessitate a new LGA 1954 platform. As we approach the second half of 2026, the stage is set for exciting developments in the desktop CPU arena, with both AMD’s Zen 6 and Intel’s Nova Lake-S at the forefront of innovation. PC enthusiasts have much to look forward to in this competitive landscape!

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