
Recent speculation suggesting the development of a dual X3D Ryzen 9000 CPU by AMD appears to be unfounded, as analysis indicates that deploying two X3D chiplets may not yield significant advantages in performance.
Is the Ryzen 9000X3D with Dual X3D CCDs a Reality? Reports Indicate Otherwise
In prior discussions, we hinted at AMD’s potential progress on the Ryzen 9000X3D CPU, which was rumored to be the first model to incorporate dual X3D chiplets across both chiplet dies (CCDs).This configuration would theoretically enhance the L3 cache from the Ryzen 9 9950X3D by an additional 64 MB, culminating in a total of 192 MB. However, this claim remains unverified, with insiders expressing skepticism about the existence of such a CPU.

A user identified as “wjm47196″from the Chiphell forums, referenced by @9550pro, firmly states that the “Dual X3D”Ryzen 9000X3D CPU does not exist. Absent substantial verification, it’s prudent to conclude that such a CPU is not in AMD’s current lineup. On a related note, there are rumors circulating about another variant, possibly a sibling to the Ryzen 7 9800X3D. Specifications for this model are reportedly consistent with those of the 9800X3D, indicating AMD’s exploration of a Ryzen 7 9700X3D variant.


According to the Chiphell user, while the Ryzen 9700X3D could premiere next year, it is expected to sport a lower thermal design power (TDP) compared to the 9800X3D. For context, both the Ryzen 5700X3D and 5800X3D operated at a maximum TDP of 105W, with despite their lower clock speeds. Thus, a similar limitation may persist with the 9700X3D.
In terms of gaming performance, one could anticipate the 9700X3D to perform comparably to the 9800X3D. However, speculation surrounding the Dual X3D configuration suggests that it would offer just a marginal 4% performance enhancement over the Ryzen 9 9950X3D, should it somehow materialize. According to 3DCenter, this minor upgrade would hardly justify the complexity and additional costs associated with a second X3D chiplet.
Both the Ryzen 9800X3D and 9950X3D have demonstrated excellent performance levels, even with a singular X3D CCD. The anticipated 4% increase falls short of providing a sufficient rationale for any associated price inflation. Additionally, integrating Dual X3D chiplets could negatively impact performance in applications sensitive to latency, thus potentially diminishing the overall advantages of the processor. It might be more logical to consider Dual X3D CPUs for future Zen 6 iterations rather than for the current Ryzen 9000 series lineup.
For further insights, refer to the original discussion on Chiphell.
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