AMD Ryzen 7 9800X3D Features Thick Dummy Silicon Making Up 93% of CCD Stack Without Performance Benefits

The AMD Ryzen 7 9800X3D features a compact chiplet design incorporated with a 3D V-Cache, measuring only 40-45µm in total thickness. However, the cumulative thickness of the additional non-functional layers reaches a substantial 750µm, serving a vital role in maintaining the chip’s structural integrity.

Structural Integrity and Design Innovations in the AMD Ryzen 7 9800X3D

When it comes to gaming performance, the AMD Ryzen 7 9800X3D stands out as a powerhouse. Building on the groundbreaking 3D V-Cache technology debuted with the Ryzen 7 5800X3D, AMD has redefined the layout of its chip design. In this latest iteration, the 3D chiplet is positioned beneath the Core Complex Die (CCD), a departure from previous models where the 3D cache was stacked above the cores. This innovative design not only lowers operational temperatures but also enhances the device’s overclocking potential, enabling the Ryzen 7 9800X3D to achieve speeds of up to 4.7 GHz at base clock settings.

According to semiconductor analyst Tom Wassick, the CCD structure of the 9800X3D reveals an intriguing characteristic: much of the silicon present does not serve a functional purpose. The practical layers, which include the CCD and SRAM, measure merely 7.2µm and 6µm respectively, contributing to the overall die stack of just 40-45µm. In contrast, the complete thickness of the CCD reaches approximately 800µm, implying that 750µm of that thickness consists of non-functional layers primarily designed for stability.

Tom Wassick Ryzen 9800X3D die design — Image Source: X

While this additional silicon is not directly involved in processing tasks, it plays a crucial role in reinforcing the overall structure, preventing damage during manufacturing or handling. Since the SRAM and CCD layers are thin and relatively fragile, the use of dummy silicon significantly mitigates risks associated with these delicate components. Furthermore, the SRAM silicon extends an additional 50µm on the sides, providing further support.

Ryzen 9800X3D 3D stack die — Image Credit: HardwareLuxx

Overall, the strategic incorporation of these non-functional layers ensures the reliability and stable operation of the AMD Ryzen 7 9800X3D’s sophisticated 3D die architecture. By reconfiguring the location of the SRAM beneath the CCD, AMD has effectively addressed various operational challenges while enhancing thermal management, ultimately delivering an exceptionally capable gaming CPU.

For further details, visit the source: @wassickt.

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