AdoredTV has just released AMD’s roadmaps for the EPYC Zen 4/4c/5 processors and the MI300 APUs on YouTube.
AMD EPYC Zen 4 and 5 confirmed on socket SP5.
In a Youtube video, AdoredTV posted several internal AMD documents regarding the brand’s server processors, including the Zen 4/4c and Zen 5 EPYC and APU MI300. Most of this information has been known for a long time, but will now be confirmed by these slides, which seem to be official.
In 2022 and 2023 we will find the following EPYCs in Zen 4 and Zen 4c, namely:
- Genoa with 96 Zen 4 cores divided into 12 x 8 CCDs, supporting PCIe 5.0 and DDR5, with TDP up to 400W.
- Bergamo with 128 Zen 4c cores divided into 8 x 16 CCDs, also with PCIe 5.0 and DDR5 support, with TDP up to 400W.
Both processors will use two sockets: “classic” SP5 and “embedded” SP6.
For embedded versions on SP6, a socket with reduced specifications compared to SP5 (number of DDR5 lanes, PCIe lanes, or CXL lanes), there will be a maximum of 32 Zen 4 cores or 64 Zen 4c cores, with a TDP of up to 225W.
APU MI300 with Zen 4 and CDNA3
The MI300 that will replace the current MI200 will indeed be an APU equipped with a Zen 4 processor and a CDNA3 GPU, all combined with HBM memory shared between them. As such, the card should arrive at AMD for testing in the third quarter of 2022.