To explore cooperation with regional partners, Lisa Su , CEO of AMD , and other senior corporate executives want to travel to Taiwan in late September or early November . AMD management plans to meet with major PC makers, chip packaging experts and Taiwan Semiconductor Manufacturing Co ( TSMC ).
During her visit, Lisa Su intends to talk about a possible future collaboration with TSMC CEO Xi Xi Wei . The use of TSMC’s ” N3 Plus ” manufacturing node (probably N3P) and N2 manufacturing technology (2nm class) is one of the topics, according to people with knowledge of the situation, according to DigiTimes .
Executives from the two companies will also talk about plans for new orders, including technologies that are either already available or will be available in the near future.
AMD’s remarkable recent success has a lot to do with TSMC’s ability to produce chips in large quantities using its highly competitive technology. AMD must ensure adequate placement at TSMC and early access to the latest process development kits if it is to continue its streak of success.
It’s time for AMD to start discussing the use of N2 for their 2026 products and beyond as TSMC will begin mass production of chips on its N2 node sometime in the second half of 2025 .
AMD’s future success will depend on state-of-the-art chip packaging technologies as well as TSMC’s advanced semiconductor manufacturing technologies, as the company will rely heavily on multi-chip chip packaging technologies.
Along with discussing long-term plans, AMD senior executives will also discuss more practical issues, such as the availability of complex printed circuit boards (PCBs) for their processors, which is one of the factors limiting the supply of AMD server processors, as well as the availability of Ajinomoto Build Films (ABF) for these printed circuit boards.
AMD executives will also meet ASMedia , which builds chipsets for the red firm, and Asus and Acer , two major Taiwanese PC makers with close ties to US chipmakers.