
Anticipated advancements in the AM6 socket will see an increase in pin deployment, significantly enhancing power delivery capabilities and I/O bandwidth.
AM6 Socket Expected to Introduce 2100 Pins for Higher Density; Set to Launch in 2028 with Zen 7
AMD is gearing up for a major socket upgrade in the years ahead, though consumers may need to wait until 2028 for the official release of the AM6 socket alongside the Zen 7 processors. In the meantime, the upcoming Zen 6 CPUs are expected to remain compatible with the existing AM5 socket, extending its operational lifespan.

With the introduction of the Zen 7 series, AMD plans to roll out the new AM6 socket, which is set to feature a significantly higher pin density than its predecessor. According to insights from Bits and Chips and details from AMD’s patent US20250149248, the AM6 will boast as many as 2100 pins, an increase from the 1718 pins found in the AM5. This represents an impressive 22% boost in pin density while retaining the same physical footprint.


Importantly, existing coolers compatible with the AM5 socket should also function with the AM6, and even AM4 coolers are likely to work. However, with the new Zen 7 architecture, cooler manufacturers may need to develop updated models tailored to the new chiplet configurations.
The increase in pin count on the AM6 socket could facilitate improved power delivery, potentially exceeding 200W. While this remains speculative, it’s notable that the AM5 socket delivers 170W through its 1718 pins; thus, the additional pins could translate into enhanced data lanes and elevated I/O bandwidth. Furthermore, there is speculation around the possibility of PCIe Gen 6.0 support on these next-generation motherboards. Despite Silicon Motion’s assertion that mainstream PCIe 6.0 won’t materialize before 2030, AMD and its partners may preemptively prepare for such advancements.
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